Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects. Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic. Thermal conductivity – 0.92 W/m-K; functional temperature range -40 degrees F to 392 degrees F (-40 degrees C to 200 degrees C) ; Avoid solder defects due to silicon contamination; easy application. In a one pound plastic jar.