Soder-Wick No Clean Desoldering Braid

$5.26

Product SKU: 60-2-5
Minimum Order Quantity: 1
Manufacturer: Chemtronics

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Description

Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen. Related Content:Desoldering Braid Tips & Tricks(Video and Article)

  • Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Patented noncorrosive, halide free, organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance

Applications

  • Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Specifications

  • MIL-F-14256 F
  • NASA-STD-8739.3 Soldered Electrical Connections
  • DOD-STD-883E, Method 2022
  • ANSI/IPC J STD-004, Type ROL0
  • Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
  • Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit