Soder-Wick No Clean Desoldering Braid

Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen. Related Content:Desoldering Braid Tips & Tricks(Video and Article)

• Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
• Minimizes the risk of damage associated with static electricity
• Patented noncorrosive, halide free, organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance

Applications

• Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
• BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Specifications

• MIL-F-14256 F
• NASA-STD-8739.3 Soldered Electrical Connections
• DOD-STD-883E, Method 2022
• ANSI/IPC J STD-004, Type ROL0
• Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
• Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit