Pace ST300 Convective Hot Air Reflow System

Pace ST300 Convective Hot Air Reflow System Description

The ST 300 is an analog, self-contained system for the manual installation and removal of SMD’s. The unit offers a non-contact heating method for the manual installation and removal of virtually any standard surface mount component including BGAs, QFNs, SOICs and many other SMDs. The system uses a pump to generate airflow that first passes through a heater, where it is warmed to the appropriate temperature, and then through a nozzle that “shapes” the air stream for the specific component. Easy-to-read dials allow adjustment of air temperature and flow rate. The ST 300 features a Quiet-Flo turbine blower for close to silent operation and immediately turns off air flow after use – the unit does not require a “cool-down” period where hot air blows through the handpiece, as competitive units do. The heavy-duty, durable metal housing ensures years of service. Additionally, the ST 300 comes with the Lo-Flo pump and the vacuum wand (PV-65 Pik-Vac Wand) for manipulating components manually. The capabilities of the ST 300 can be greatly enhanced when coupled with the ST 500A Z-Avis Platform, and PACE Preheaters such as the PH 100, ST 400 or ST 1600.

Pace ST300 Convective Hot Air Reflow System Features

• Lockable Temperature Airflow adjustment knob
• Automatic shut off for safety
• Functional LED Indicator lights on front panel
• Quiet-Flo turbine blower reduces operating noise
• Hi-Flo Vacuum Pump for holding component securely
• Lo-Flo Vacuum Pump for component wand

Pace ST300 Convective Hot Air Reflow System Specifications

• Power Requirements: 197-253 VAC, 50/60 Hz, 575Watts max
• Temperature Control: Closed loop temperature control
• Closed loop temperature control: 9°C (° 15 °F) at idle tip temp.
• Temperature Range: 176°to 482°C (350°to 900°F) nominal
• Airflow: 5-22 slpm