- Antistatic, low tribocharging
- Minimizes charge generation; material will conduct charges if grounded
- Conductive – corrosion resistant
Ideal for long term storage
- Uniform protection
Will not affect the solderability of device leads
- Lead-free RoHS Compliant
- Made in the United States of America
This item is made and stocked in Canton, MAEstimated Shipping Weight: 1.43 Pounds
High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge.
Size: 24″ x 36″
Volume Resistivity: 10E3 – 10E5 ohms
Surface Resistivity: 10E3 – 10E5 ohms
This item is built-to-order.