Chemask® NA Non-Ammoniated Solder Masking Agent is a latex and ammonia free, fast curing, peelable temporary spot mask formulated for safe use on sensitive metals. It contains high-temperature resistant compounds that protect component-free areas during wave soldering. Chemask® NA may be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes. CLICK HERE FOR MASK SELECTION GUIDE
- Will not affect gold, copper, nickel, silver and OSP finishes
- For lead-free or tin/lead processes
- Stable to 550º F (288ºC)
- Phthalate-free, low toxicity and environmentally safe
- Compatible with rosin, no-clean and water soluble flux types
- Dries tack free in 15 minutes
- Can be placed directly into pre-heat oven without waiting
- Removes easily and leaves no residue
- Non-contaminating, non-staining and noncorrosive
- RoHS compliant
Applications
- Engineered for use with bare copper, silver, and other reactive metals
- Ideal for SMT applications
